




Soldering device for circuit boards (e.g. Type: SMD &/or Composite design) and drying SMD adhesive.
Soldering unit works with functions -->intake - flow - soldering - cooling
With software functions
Can be integrated in a production line
Further technical details:
Inert gas with Nitrogen 30 m³/h; 6 - 10 bar over pressure
Water requirement: 20 Liter/min; 2 - 5 bar over pressure
Exhaust quantity: 1000m³/h
electr. Operation capacity: 12 kW
Rom required: L: 6500 + loading station 2000 x W: 1400 x H: 2100mm
Supplementary equipment incl.:
Automatic stacker LSB 03 with reloading device and discharge conveyor for intake of e.g. circuit boards
Dokumentation
Возможны изменения и неточности в технических данных и характеристиках, а также возможность продажи до поступления товара.