Additional description
- Soldering device for circuit boards (e.g. Type: SMD &/or Composite design) and drying SMD adhesive.
- Soldering unit works with functions -->intake - flow - soldering - cooling
- With software functions.
- Can be integrated in a production line.
Further technical details:
- Inert gas with Nitrogen 30 m³/h; 6 - 10 bar over pressure
- Water requirement: 20 Liter/min; 2 - 5 bar over pressure
- Exhaust quantity: 1000m³/h
- electr. Operation capacity: 12 kW
- room required: L: 6500 + loading station 2000 x W: 1400 x H: 2100mm
Supplementary equipment incl.:
- Automatic stacker LSB 03 with reloading device and discharge conveyor for intake of e.g. circuit boards
- Plant is applicable as spare part deliverer or for refurbishment or rebuild.
- Documentation available
- Machine is CE98 certified
On sale as is.
Subject to changes and errors in technical details and specifications, as well as prior sale.